• タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社
  • タイタンテクノロジーズ株式会社

MEMS Components

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3D Circuit Carrier

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Customized 3D-MID Design for Effective Miniaturization


MID technology - Mechatronic Integrated Devices

 

2C-Injection Moulding Technology

Hot Embossing Technology

2K demonstrator by PKT

(red = non-metalisable plastic, gold = metalisable plastic after metallisation)

 

Automotive seat adjustment switches

Since 1998, 2E mechatronic has been a member in 3D-MID e.V., Nuremberg, and has been dealing with MID technology (MechatronicIntegrated Devices). The target is miniaturization of microsystem technical components and systems, as well as functional integration at concurrent reduction of the parts diversity. At the moment, there are three common methods to produce MIDs on the market. Two methods are to be only mentioned briefly here, since one procedure covers by far the greatest part of the serial applications now. The 2C method (2-component injection moulding) uses a metalisable and a non-metalisable plastic. After the injection processes, the resulting plastic compound goes through various metallisation baths without external current with the target of closed conductor structures having formed on the metalisable plastic at the end of this process. Afterwards, equipment with electrical parts usually takes place. The procedure is suitable particularly for very high piece numbers, since two injection moulding tools are needed and changes to the conductor pattern usually require investments in new tools. The minimum conductor width in this procedure is approx. 250µm.

Another way of producing MID is the hot embossing process. Different thermoplastics can be used here. They do not have to be metalisable, i.e. doped with metal cores. This reduces the material costs for the circuit carrier. However, only two-dimensional parts can be produced in this method, since the conductors are produced by embossing of a copper film (with different surfaces) into the plastic body with an embossing stamp. The special film is available in different thicknesses from approx. 18µm-70µm by default. The metallisation process is dispensed with here, but hot-embossing stamps that determine the conductor layout must be produced for embossing. When embossing, the conductor layout is embossed in the plastic due to the structure shown raised in the upper embossing stamp and the film is at the same time sheared off at the conductor edges. The remaining foil is then removed and the circuit carrier (if desired) equipped with electrical components or contacts. The adhesive strength of the conductors corresponds about to that of FR4 PCBs. The minimum conductor width is approx. 300µm.

 

Laser Direct Structuring Technology

 

Manufacturing Process

  1. 1C- injection moulded part with additive already incorporated into Thermoplastic
  2. Laser structuring, Purification
  3. Electroless Metallization
  4. Dispense
  5. SMD-Assembly
  6. Vapour Phase Soldering and Function test

 

 

Prototypes

Prototyping leads to both time and cost advantages in product development. Even during the planning phase we manufacture efficient and uncomplicated functioning prototypes from original material within a few weeks.

The basis for this is the 3-dimensional CAD data which is implemented in the following processes such as milling, laser structuring, metallization, assembly and bonding.

 

 

 

 

Examples for serial MID, produced in the LDS procedure: OLED, Flow Sensor and LED diode

 

 

 

Titan Technologies, K.K.

8-5-7-301 Minami-Senju, Arakawa-Ku, Tokyo 116-0003 Japan